Design, Fabrication and Testing of Conformal, Localized Wafer-level Packaging for RF MEMS Devices

Design, Fabrication and Testing of Conformal, Localized Wafer-level Packaging for RF MEMS Devices

A low-cost, low-temperature packaging concept is proposed for localized sealing and control of the ambient of a device cavity appropriate for Radio-Frequency (RF) Micro- Electro-Mechanical (MEMS) devices, such as resonators and switches. These devices require application specific packaging to facili...

Full description

Bibliographic Details
Main Author: Collins, Gustina B.
Other Authors: Electrical and Computer Engineering
Format: Others
Published: Virginia Tech 2014
Subjects:
wafer-level packaging
RF MEMS
MEMS Packaging
monolithic packaging
hermetic packaging
eutectic bonding
Online Access:http://hdl.handle.net/10919/29673
http://scholar.lib.vt.edu/theses/available/etd-11192006-102013/

Internet

http://hdl.handle.net/10919/29673
http://scholar.lib.vt.edu/theses/available/etd-11192006-102013/

Similar Items