Thermal and Thermo-Mechanical Analyses of Wire Bond vs. Three-dimensionally Packaged Power Electronics Modules
The goal of more efficiently and more reliably realizing energy conversion in the power electronics industry is pushing the limits of current wire bonding packaging technology. Emerging three-dimensional power packaging techniques have shown their potential to replace wire bonding technology down t...
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Virginia Tech
2014
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| Online Access: | http://hdl.handle.net/10919/30823 http://scholar.lib.vt.edu/theses/available/etd-0106100-113320/ |