Three-Dimensional Heterogeneous Integration for RF/Microwave Applications

Three-Dimensional Heterogeneous Integration for RF/Microwave Applications

High performance RF/mixed signal systems require new interconnect strategies to combine high frequency (microwave/mm-wave) circuitry with silicon mixed-signal and baseband digital processing. In such systems, heterogeneous vertical integration, in which circuits in different technologies can be stac...

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Bibliographic Details
Main Author: Wood, Joseph Lee
Other Authors: Electrical and Computer Engineering
Format: Others
Published: Virginia Tech 2014
Subjects:
mm-wave
Integration
interconnect
vertical
coplanar waveguide
heterogeneous
liquid metal
Online Access:http://hdl.handle.net/10919/30977
http://scholar.lib.vt.edu/theses/available/etd-01172009-055053/

Internet

http://hdl.handle.net/10919/30977
http://scholar.lib.vt.edu/theses/available/etd-01172009-055053/

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