Quantitative evaluation of thin film adhesion using the probe test

In this study, a test technique, referred to as the probe test, has been developed as a quantitative tool for measuring the adhesion in thin adhesive films and coatings. The technique was initially developed as a qualitative test by the Hewlett-Packard Company for measuring adhesion of thin film mic...

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Bibliographic Details
Main Author: Chadha, Harpreet Singh
Other Authors: Engineering Science and Mechanics
Format: Others
Published: Virginia Tech 2014
Subjects:
Online Access:http://hdl.handle.net/10919/35426
http://scholar.lib.vt.edu/theses/available/etd-10182006-081706/