Electromagnetic Modeling of Packaging Layout in Power Electronic Modules
This thesis presents the modeling approaches and the challenges involved in electromagnetic modeling of packaging layout. It discusses the methodologies that are being used today. It then applies these methodologies to analyze, model and characterize three packaging technologies: (i) the wirebond te...
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Virginia Tech
2014
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| Online Access: | http://hdl.handle.net/10919/36110 http://scholar.lib.vt.edu/theses/available/etd-121399-153938/ |