Electromagnetic Modeling of Packaging Layout in Power Electronic Modules
This thesis presents the modeling approaches and the challenges involved in electromagnetic modeling of packaging layout. It discusses the methodologies that are being used today. It then applies these methodologies to analyze, model and characterize three packaging technologies: (i) the wirebond te...
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ndltd-VTETD-oai-vtechworks.lib.vt.edu-10919-361102020-09-29T05:41:38Z Electromagnetic Modeling of Packaging Layout in Power Electronic Modules Siddabattula, Kalyan C. Electrical and Computer Engineering Boroyevich, Dushan Lu, Guo-Quan Lee, Fred C. Packaging Modeling This thesis presents the modeling approaches and the challenges involved in electromagnetic modeling of packaging layout. It discusses the methodologies that are being used today. It then applies these methodologies to analyze, model and characterize three packaging technologies: (i) the wirebond technology, (ii) The Metal Post Interconnected Parallel Plate Structure, and the (iii) Multi Layer Structure. The model developed is validated through experimentation. These models are then used in simulation in order to compare the electrical performance of the packaging technologies. Finally some problems with the existing designs are pointed out, and suggestions (both local and generic) are given to improve the layout design. Master of Science 2014-03-14T20:49:29Z 2014-03-14T20:49:29Z 1999-12-03 1999-12-13 2001-01-06 2000-01-06 Thesis etd-121399-153938 http://hdl.handle.net/10919/36110 http://scholar.lib.vt.edu/theses/available/etd-121399-153938/ Siddabattula_ETD.pdf In Copyright http://rightsstatements.org/vocab/InC/1.0/ application/pdf Virginia Tech |
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Packaging Modeling Siddabattula, Kalyan C. Electromagnetic Modeling of Packaging Layout in Power Electronic Modules |
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This thesis presents the modeling approaches and the challenges involved in electromagnetic modeling of packaging layout. It discusses the methodologies that are being used today. It then applies these methodologies to analyze, model and characterize three packaging technologies: (i) the wirebond technology, (ii) The Metal Post Interconnected Parallel Plate Structure, and the (iii) Multi Layer Structure. The model developed is validated through experimentation. These models are then used in simulation in order to compare the electrical performance of the packaging technologies.
Finally some problems with the existing designs are pointed out, and suggestions (both local and generic) are given to improve the layout design. === Master of Science |
author2 |
Electrical and Computer Engineering |
author_facet |
Electrical and Computer Engineering Siddabattula, Kalyan C. |
author |
Siddabattula, Kalyan C. |
author_sort |
Siddabattula, Kalyan C. |
title |
Electromagnetic Modeling of Packaging Layout in Power Electronic Modules |
title_short |
Electromagnetic Modeling of Packaging Layout in Power Electronic Modules |
title_full |
Electromagnetic Modeling of Packaging Layout in Power Electronic Modules |
title_fullStr |
Electromagnetic Modeling of Packaging Layout in Power Electronic Modules |
title_full_unstemmed |
Electromagnetic Modeling of Packaging Layout in Power Electronic Modules |
title_sort |
electromagnetic modeling of packaging layout in power electronic modules |
publisher |
Virginia Tech |
publishDate |
2014 |
url |
http://hdl.handle.net/10919/36110 http://scholar.lib.vt.edu/theses/available/etd-121399-153938/ |
work_keys_str_mv |
AT siddabattulakalyanc electromagneticmodelingofpackaginglayoutinpowerelectronicmodules |
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1719345225486303232 |