Thermomechanical Reliability of Low-Temperature Sintered Attachments on Direct Bonded Aluminum (DBA) Substrate for High-Temperature Electronics Packaging
This study focused on the development and evaluation of die-attach material and substrate technology for high-temperature applications. For the die-attach material, a low-temperature sintering technique enabled by a nanoscale silver paste was developed for attaching large-area (>100 mm2) semicond...
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Virginia Tech
2014
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| Online Access: | http://hdl.handle.net/10919/37803 http://scholar.lib.vt.edu/theses/available/etd-05132010-174237/ |