Design and fabrication of an underwater digital signal processor multichip module on low temperature cofired ceramic
An Underwater Digital Signal Processor (UDSP) multichip module (MCM) was designed and fabricated according to specifications outlined by the Naval Surface Warfare Center (NSWC), Dahlgren Division. Specifications indicated that low temperature cofired ceramic (L TCC) technology be used to fabricate t...
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| Format: | Others |
| Language: | en |
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Virginia Tech
2014
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| Online Access: | http://hdl.handle.net/10919/41388 http://scholar.lib.vt.edu/theses/available/etd-03042009-040331/ |