Analysis of high density interconnect alternatives in multichip module packaging using the analytic hierarchy process
<p>Packaging of high density integrated circuits offers many challenges in the electronics industry today. Advanced requirements for high performance computing are starting to take advantage of multichip modules that are smaller in size and weight, use less energy, and cost less than prior tec...
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| Format: | Dissertation |
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Virginia Tech
2014
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| Online Access: | http://hdl.handle.net/10919/41645 http://scholar.lib.vt.edu/theses/available/etd-03172010-020042/ |