Thermal modeling of hybrid microelectronics
<p>As the size of hybrid microelectronics is reduced, the power density increases and thermal interaction between heat-producing devices becomes significant. A nondimensional model is developed to investigate the effects of heat source interaction on a substrate. The results predict the maximu...
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| Format: | Others |
| Language: | en |
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Virginia Tech
2014
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| Online Access: | http://hdl.handle.net/10919/42141 http://scholar.lib.vt.edu/theses/available/etd-04182009-041237/ |