A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials
Thermosonic ball bonding is the most popular method used to create electrical interconnects between integrated circuits (ICs) and substrates in the microelectronics industry. Traditionally gold (Au) wire is used, however with industry demands for lower costs and higher performance, novel wire materi...
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| Language: | en |
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2010
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| Online Access: | http://hdl.handle.net/10012/5136 |