Development of Non-planar Interconnects for Flexible Substrates using Laser-assisted Maskless Microdeposition
With the industry striving for smaller devices, new technologies are developed to further miniaturize electronics devices. To this end, realization of 3D/non-planar interconnects, which aim at miniaturizing the interconnects formed between components on the same device, has attracted many researcher...
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| Language: | en |
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2012
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| Online Access: | http://hdl.handle.net/10012/6992 |