Chemical reactions at the interfaces of semiconductors and catalysts with solutions: I. Tin-palladium catalysts in electroless copper plating. II. Dissolution of crystalline gallium-arsenide in solutions containing complexing agents.
The concentration of tin and palladium in catalysts used in electroless copper plating have been determined by Rutherford backscattering spectrometry with high energy (2-5) MeV ⁴He⁺. The tin:palladium ratio in the catalyst decreases when exposed to an alkaline solution. X-ray photoelectron spectrosc...
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| Language: | en |
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The University of Arizona.
1989
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| Online Access: | http://hdl.handle.net/10150/184673 |