Finite element thermomechanical analysis of electronic packaging problems using disturbed state constitutive models.
In this dissertation a finite element procedure using the Disturbed State Concept constitutive models is proposed for the thermomechanical analysis of electronics packaging problems. First, microelectronics packaging types and the problems facing the electronics industry are discussed. Next, the lit...
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| Language: | en |
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The University of Arizona.
1994
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| Online Access: | http://hdl.handle.net/10150/186961 |