Thin layer with circular debonding over a substrate under either axisymmetric compression or thermal loading.
The objective of this dissertation is to present analytical solutions to the problem of a circular debonded thin film on a substrate subjected to either axisymmetric compressive stress or uniform thermal loading. In the case of the axisymmetric compressive stress, the solution method utilizes the th...
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| Language: | en |
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The University of Arizona.
1996
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| Online Access: | http://hdl.handle.net/10150/187500 |