LPCVD TUNGSTEN MULTILAYER METALLIZATION FOR VLSI SYSTEMS.
Advances in microlithography, dry etching, scaling of devices, ion-implantation, process control, and computer aid design brought the integrated circuit technology into the era of VLSI circuits. Those circuits are characterized by high packing density, improved performance, complex circuits, and lar...
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| Language: | en |
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The University of Arizona.
1985
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| Online Access: | http://hdl.handle.net/10150/187983 http://arizona.openrepository.com/arizona/handle/10150/187983 |