Oxalic Acid Based Chemical Systems for Electrochemical Mechanical Planarization of Copper
In an ECMP process, a wafer is anodically baised during polishing. The electrical potential is the driving force to oxidize copper metal to ions. Copper ions then react with chemistry in the electrolyte to go in solution or form a passivation layer on the surface. The passivation layer is removed by...
| Main Author: | |
|---|---|
| Other Authors: | |
| Language: | EN |
| Published: |
The University of Arizona.
2006
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10150/193886 |