Treatment of Cu-CMP Waste Streams Containing Copper(II) using Polyethyleneimine (PEI)
The semiconductor industry has been growing at a fast pace in the last several decades and this growth is expected to continue in the future. One process that is repeated several times in a microchip fabrication is the Chemical Mechanical Planarization (CMP). CMP is a critical process that must be e...
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| Language: | EN |
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The University of Arizona.
2007
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| Online Access: | http://hdl.handle.net/10150/193929 |