Chemical Systems for Electrochemical Mechanical Planarization of Copper and Tantalum Films
Electro-Chemical Mechanical Planarization (ECMP) is a new and highly promising technology just reaching industrial application; investigation of chemistries, consumables, and tool/control approaches are needed to overcome technological limitations. Development of chemical formulations for ECMP prese...
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| Language: | EN |
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The University of Arizona.
2008
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| Online Access: | http://hdl.handle.net/10150/194160 |