Pad-Wafer and Brush-Wafer Contact Characterization in Planarization and Post-Planarization Processes

Pad-Wafer and Brush-Wafer Contact Characterization in Planarization and Post-Planarization Processes

This dissertation presents a series of studies relating to pad-wafer and brush-wafer contact characterization in planarization and post-planarization processes. These are also evaluated with the purposes of minimizing environmental impact and reducting cost of ownership.Firstly, a new method using s...

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Bibliographic Details
Main Author: SUN, TING
Other Authors: Philipossian, Ara
Language:EN
Published: The University of Arizona. 2009
Subjects:
CMP
pad-wafer contact
post-CMP scrubbing
Online Access:http://hdl.handle.net/10150/194898

Internet

http://hdl.handle.net/10150/194898

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