Colloidal and Electrochemical Aspects of Copper-CMP
Copper based interconnects with low dielectric constant layers are currently used to increase interconnect densities and reduce interconnect time delays in integrated circuits. The technology used to develop copper interconnects involves Chemical Mechanical Planarization (CMP) of copper films deposi...
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| Language: | en |
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The University of Arizona.
2007
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| Online Access: | http://hdl.handle.net/10150/194903 |