Supercritical Carbon Dioxide Processing of Silicon Wafer Surfaces
RC (resistance x capacitance) time constant delay, cross-talk noise, and power dissipation of the interconnect structure become limiting factors for the performance of integrated circuits (IC) as device feature sizes continue to scale down. To address these problems, copper has replaced aluminum for...
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| Language: | EN |
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The University of Arizona.
2005
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| Online Access: | http://hdl.handle.net/10150/195210 |