Novel and Efficient Numerical Analysis of Packaging Interconnects in Layered Media
Technology trends toward lower power, higher speed and higher density devices have pushed the package performance to its limits. The high frequency effects e.g., crosstalk and signal distortion, may cause high bit error rates or malfunctioning of the circuit. Therefore, the successful release of a n...
| Main Author: | |
|---|---|
| Other Authors: | |
| Language: | EN |
| Published: |
The University of Arizona.
2005
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10150/195320 |