Optimization of Ammonia-Peroxide Water Mixture (APM) for High Volume Manufacturing through Surface Chemical Investigations
Ammonia-peroxide mixture (APM) is a widely used wet chemical system for particle removal from silicon surfaces. The conventional APM solution in a volume ratio of 1:1:5 (NH4OH:H2O2:H2O) is employed at elevated temperatures of 70-80 °C. At these temperatures, APM solution etches silicon at a rate of...
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| Language: | en |
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The University of Arizona.
2011
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| Online Access: | http://hdl.handle.net/10150/201511 |