Thermal characterization of VLSI packaging
With electronic packaging becoming more complex, simple hand methods to model the thermal performance of the package are insufficient. As computer aided modeling methods came into use, a test system was developed to verify the predictions produced by such modeling methods. The test system is evaluat...
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| Language: | en_US |
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The University of Arizona.
1988
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| Online Access: | http://hdl.handle.net/10150/276686 |