THERMAL MODELING/SIMULATION OF LEVEL 1 AND LEVEL 2 VLSI PACKAGING

THERMAL MODELING/SIMULATION OF LEVEL 1 AND LEVEL 2 VLSI PACKAGING

Bibliographic Details
Main Author: Jafar, Mutaz, 1960-
Language:en_US
Published: The University of Arizona. 1986
Subjects:
Integrated circuits > Very large scale integration.
Online Access:http://hdl.handle.net/10150/276959

Internet

http://hdl.handle.net/10150/276959

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