Effects of downset and die coat on stress sensitivity in a 16-pin molded plastic DIP
Stress sensitivity of a 16 - bit D/A converter in a molded plastic DIP has been studied. Device performance was shown to change as a function of package stress. The effects of die position in the package and the presence or absence of die coat on package stress and device performance were determined...
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| Language: | en_US |
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The University of Arizona.
1989
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| Online Access: | http://hdl.handle.net/10150/277001 http://arizona.openrepository.com/arizona/handle/10150/277001 |