FEM analysis with DSC modeling for materials in chip-substrate systems
In electronic packaging, solder joints in surface mount technology are used for not only electrical connections, but mechanical connections as well. Due to the mismatch of the coefficients of thermal expansion of different components in chip-substrate systems, solder joints under thermal cycles coul...
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| Language: | en_US |
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The University of Arizona.
2003
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| Online Access: | http://hdl.handle.net/10150/280363 |