Use of Formulations Based On Choline Chloride-Malonic Acid Deep Eutectic Solvent for Back End of Line Cleaning in Integrated Circuit Fabrication
Interconnection layers fabricated during back end of line processing in semiconductor manufacturing involve dry etching of a low-k material and deposition of copper and metal barriers to create copper/dielectric stacks. After plasma etching steps used to form the trenches and vias in the dielectric,...
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| Language: | en |
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The University of Arizona.
2013
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| Online Access: | http://hdl.handle.net/10150/283692 |