Control Of Slurry Flow, Temperature And Aggressive Diamonds In Chemical Mechanical Planarization

Control Of Slurry Flow, Temperature And Aggressive Diamonds In Chemical Mechanical Planarization

This dissertation presents a series of studies related to the study and control of slurry flow, process temperature, and aggressive diamonds in Chemical Mechanical Planarization (CMP). The purpose of these studies is to better understand the fundamentals of CMP and to explore solutions to some of CM...

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Bibliographic Details
Main Author: Wu, Changhong
Other Authors: Philipossian, Ara
Language:en_US
Published: The University of Arizona. 2015
Subjects:
diamond
pad surface thermal management
slurry flow
slurry injection system
temperature
Chemical Engineering
chemical mechanical planarization
Online Access:http://hdl.handle.net/10150/556601

Internet

http://hdl.handle.net/10150/556601

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