Slurry Mean Residence Time Analysis and Pad-Wafer Contact Characterization in Chemical Mechanical Planarization
This dissertation presents a series of studies related to the slurry mean residence time analysis and the pad-wafer contact characterization in Chemical Mechanical Planarization (CMP). The purpose of these studies is to further understand the fundamentals of CMP and to explore solutions to some of C...
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| Language: | en_US |
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The University of Arizona.
2016
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| Online Access: | http://hdl.handle.net/10150/621459 http://arizona.openrepository.com/arizona/handle/10150/621459 |