Effect of Grain Orientation on Electromigration in Sn-0.7Cu Solder Joints
abstract: Microelectronic industry is continuously moving in a trend requiring smaller and smaller devices and reduced form factors with time, resulting in new challenges. Reduction in device and interconnect solder bump sizes has led to increased current density in these small solders. Higher level...
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| Format: | Dissertation |
| Language: | English |
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2013
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| Online Access: | http://hdl.handle.net/2286/R.I.20827 |