Quantifying Electromigration Processes in Sn-0.7Cu Solder with Lab-Scale X-Ray Computed Micro-Tomography
abstract: For decades, microelectronics manufacturing has been concerned with failures related to electromigration phenomena in conductors experiencing high current densities. The influence of interconnect microstructure on device failures related to electromigration in BGA and flip chip solder inte...
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| Format: | Doctoral Thesis |
| Language: | English |
| Published: |
2015
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| Online Access: | http://hdl.handle.net/2286/R.I.29809 |