Adhesion in a Copper-Ruthenium Multilayer Nano-scale Structure and the Use of a Miedema Plot to Select a Diffusion Barrier Metal for Copper Metallization
abstract: Miedema's plot is used to select the Cu/metal barrier for Cu metallization.The Cu/metal barrier system selected should have positive heat of formation (Hf) so that there is no intermixing between the two layers. In this case, Ru is chosen as a potential candidate, and then the barrier...
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| Format: | Dissertation |
| Language: | English |
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2010
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| Online Access: | http://hdl.handle.net/2286/R.I.8754 |