Multiscale Modeling of Mechanical Shock Behavior of Environmentally-Benign Lead-Free Solders in Electronic Packaging

Multiscale Modeling of Mechanical Shock Behavior of Environmentally-Benign Lead-Free Solders in Electronic Packaging

abstract: With the increasing focus on developing environmentally benign electronic packages, lead-free solder alloys have received a great deal of attention. Mishandling of packages, during manufacture, assembly, or by the user may cause failure of solder joint. A fundamental understanding of the b...

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Bibliographic Details
Other Authors: Fei, Huiyang (Author)
Format: Doctoral Thesis
Language:English
Published: 2011
Subjects:
Mechanical Engineering
Materials Science
Electrical Engineering
Interfacial law
Intermetallic
Lead-free solder
Mechanical shock
Microstructural fracture
Random defects
Online Access:http://hdl.handle.net/2286/R.I.9321

Internet

http://hdl.handle.net/2286/R.I.9321

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