Multiscale Modeling of Mechanical Shock Behavior of Environmentally-Benign Lead-Free Solders in Electronic Packaging
abstract: With the increasing focus on developing environmentally benign electronic packages, lead-free solder alloys have received a great deal of attention. Mishandling of packages, during manufacture, assembly, or by the user may cause failure of solder joint. A fundamental understanding of the b...
Other Authors: | Fei, Huiyang (Author) |
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Format: | Doctoral Thesis |
Language: | English |
Published: |
2011
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Subjects: | |
Online Access: | http://hdl.handle.net/2286/R.I.9321 |
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