Investigation of plastic package related failure mechanisms in plastic encapsulated integrated circuits
An experimental study has been conducted into the effects of package related failures in plastic encapsulated semiconductors. As a result of an extensive literature survey particular emphasis was placed on thermal and moisture related failure mechanisms. A number of accelerated life testing techniqu...
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Loughborough University
1996
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| Online Access: | http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.389679 |