The development of novel heat sinks using selective laser melting
Heat removal from electronic systems relies on forced convection heat transfer from extended surfaces. The favoured extended surface for avionics enclosures is the cast pin fm array. However, due to the increasing heat dissipation of electronic components, the cooling offered by cylindrical arrays w...
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University of Liverpool
2007
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| Online Access: | http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.486445 |