Design, characterization and realization of thin film packaging for both broadband and high power applications
In recent years, high frequency MMICs have witnessed rapid development in terms of miniaturization, higher powers and increasing functionality, whilst the cost per unit has been simultaneously reduced. Cost-wise, modern packages have been unable to follow the same trend as the reduction seen in semi...
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Cardiff University
2007
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| Online Access: | http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.584049 |