Real-time automated visual inspection of integrated circuit wire-bonds
Among the various stages in the IC assembly process, wire-bonding is a most crucial stage, that has a major influence on the yield, because it is a mechanical process which is being performed at microscopic scale. Wire-bonding involves making a physical connection between the bond pads on an integra...
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Swansea University
1995
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| Online Access: | http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.637995 |