Sheet resistance and electrical linewidth test structures for semiconductor process characterisation
The thesis first examines the use of the cross-bridge electrical linewidth structure to measure the sheet resistance and critical dimensions of copper damascene interconnect. This was achieved through computer simulation of current flow in the structures and served to highlight the effects of the da...
| Main Author: | |
|---|---|
| Published: |
University of Edinburgh
2002
|
| Subjects: | |
| Online Access: | http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.662146 |