Novel fine pitch interconnection methods using metallised polymer spheres
There is an ongoing demand for electronics devices with more functionality while reducing size and cost, for example smart phones and tablet personal computers. This requirement has led to significantly higher integrated circuit input/output densities and therefore the need for off-chip interconnect...
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Loughborough University
2016
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| Online Access: | http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.694241 |