Passively aligned packaging solutions for silicon photonics
Packaging is a critical component in bringing silicon photonics to application. Without low cost, high throughput packaging, the per‐unit cost of silicon photonic integrated circuits will be too high for mass markets. Passive alignment of optical fibres to silicon photonic waveguides would significa...
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University of Southampton
2016
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| Online Access: | https://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.741616 |