A sparsity-based framework for resolution enhancement in optical fault analysis of integrated circuits
The increasing density and smaller length scales in integrated circuits (ICs) create resolution challenges for optical failure analysis techniques. Due to flip-chip bonding and dense metal layers on the front side, optical analysis of ICs is restricted to backside imaging through the silicon substra...
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| Language: | en_US |
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2016
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| Online Access: | https://hdl.handle.net/2144/15189 |