Resource and thermal management in 3D-stacked multi-/many-core systems
Continuous semiconductor technology scaling and the rapid increase in computational needs have stimulated the emergence of multi-/many-core processors. While up to hundreds of cores can be placed on a single chip, the performance capacity of the cores cannot be fully exploited due to high latencies...
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| Language: | en_US |
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2017
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| Online Access: | https://hdl.handle.net/2144/20837 |