Electrodeposition and Electroless Deposition of Copper in Interconnect Technology and Biotechnology Related Applications
Electroless copper deposition is a promising alternative technique for interconnect fabrication because it may be difficult for electrodeposition to fill features that are 10 nm and smaller. An electroless copper bath of low toxicity and mild operating conditions with dimethylamine borane (DMAB) as...
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| Language: | English |
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2015
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| Online Access: | https://doi.org/10.7916/D83X8634 |