An effective chemical mechanical polishing fill insertion approach
To reduce chip-scale topography variation, dummy fill is commonly used to improve the layout density uniformity. Previous works either sought the most uniform density distribution or sought to minimize the inserted dummy fills while satisfying certain density uniformity constraint. However, due to m...
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| Format: | Others |
| Language: | English Chinese |
| Published: |
2015
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| Online Access: | http://repository.lib.cuhk.edu.hk/en/item/cuhk-1291515 |