Design and analysis of micro-channel heat-exchanger embedded in Low Temperature Co-fire Ceramic (LTCC)
Increased device density, switching speeds of integrated circuits and decrease in package size is placing new demands for high power thermal-management. The convectional method of forced air cooling with passive heat sink can handle heat fluxes up-to 3-5W/cm2; however current microprocessors are ope...
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| Format: | Others |
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FIU Digital Commons
2004
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| Online Access: | http://digitalcommons.fiu.edu/etd/1160 http://digitalcommons.fiu.edu/cgi/viewcontent.cgi?article=2355&context=etd |