Characterizing the Aging-Driven Degradation Rate of Electrical Contact Resistance and Mechanical Integrity of Plastic-Encapsulated Au/Al Wire Bonds
Gold-aluminum interconnect is an integral part of conventional chip packaging. The gold-aluminum interface deteriorates during the operation of a device due to the formation of gold-aluminum intermetallic compounds. Spatial changes during intermetallic formation cause voids, which separate the inter...
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| Format: | Others |
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North Dakota State University
2015
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| Online Access: | http://hdl.handle.net/10365/24926 |