Natural convection immersion cooling of an array of simulated chips in an enclosure filled with dielectric liquid.

Natural convection immersion cooling of an array of simulated chips in an enclosure filled with dielectric liquid.

Bibliographic Details
Main Authors: Pamuk, Turgay., Kelleher, Matthew D.
Other Authors: Matthew Dennis Kelleher
Language:en_US
Published: 2012
Online Access:http://hdl.handle.net/10945/22377

Internet

http://hdl.handle.net/10945/22377

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